Industry News | 2015-09-03 16:20:48.0
Metcal today announced that Paul Wood is speaking at the BEST Tech Symposium on Small Package Challenges, scheduled to take place Thursday, Oct. 1, 2015 at Pinstripes - South Barrington in South Barrington, IL. Mr. Wood will present “Hand Soldering Techniques for Small Packages.”
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2024-03-18 12:41:07.0
PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.
Industry News | 2024-03-18 12:40:54.0
PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.
Industry News | 2021-02-12 16:18:20.0
Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2014-02-18 17:06:29.0
VJ Electronix, Inc. will exhibit in Booth #2553 at the APEX EXPO 2014 exhibition and conference, scheduled to take place March 25-27, 2014 at the Mandalay Bay resort and Conference Center in Las Vegas, Nevada.
Industry News | 2010-10-28 11:30:17.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that it has been awarded a Global Technology Award in the category of Inspection-X-ray for its NEXUS 300 Masking Tool for X-ray Inspection Systems.
Industry News | 2008-01-23 13:15:18.0
The Verifier H Series X-Ray Inspection System will be shown (in Booth #262) at the upcoming Medical Design & Manufacturing (MD&M) West 2008 exhibition January 29-31, 2008 in Anaheim, CA.
Industry News | 2014-09-15 11:54:22.0
With production volumes of mobile phones and tablet PCs growing, and indeed the predicted growth of ‘wearables’, the need to decrease development cycles and improve capacity is ever more important. SolderStar Ltd, a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, has developed new technology to help in the production of this growing trend.
