Industry News | 2016-11-14 19:33:31.0
Pickering Interfaces will be showcasing their latest PXI & LXI switching and simulation solutions and software in booth 216 at the International Test Expo (ITC 2016), November 15 - 17, 2016. These products include:
Industry News | 2010-09-26 15:48:56.0
Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2012-02-22 00:38:44.0
The Solar Engineering & Manufacturing Association (SEMA) and SMTA announce a reduced cost for those that register by Friday, February 24, 2012 for the Solar Manufacturing & Reliability Conference program, which is taking place March 22-23, 2012 at the Fairmont Hotel in San Jose, CA.
Industry News | 2012-06-05 15:47:34.0
Engineered Material Systems introduces 535-10M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.
Industry News | 2012-11-23 06:55:36.0
Power modules with split phase output, deactivating the MOSFETs’ body diode, make it easier to power the semiconductors
Industry News | 2013-11-28 07:37:50.0
The split output topology negates the limitations of the SiC MOSFET.
Industry News | 2014-11-10 11:42:36.0
Pickering Interfaces is pleased to announce a significant milestone in providing test engineers with the optimum PXI solutions for their Test & Measurement applications. The company now offers over 1000 PXI modules, ranging from their BRIC™ high density switching matrices, RF/microwave and optical switching products through to precision resistor switching networks for sensor emulation.
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
Industry News | 2019-05-31 15:12:04.0
The highly integrated Java-programmable JoC Module can replace conventional microcontroller electronics and simplifies hardware design. Direct integration into the application hardware eliminates the need for complex and time-consuming low-level development.
Industry News | 2021-06-08 09:26:10.0
ARIES Embedded Expands System-on-Modules Product Range with First RISC-V Based FPGA ModuleARIES Embedded Expands System-on-Modules Product Range with First RISC-V Based FPGA Module
