Industry News: modulus (Page 1 of 4)

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Industry News | 2013-09-24 14:26:38.0

Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Industry News | 2013-10-22 14:45:08.0

Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Industry News | 2014-01-07 18:42:22.0

Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Industry News | 2014-02-11 15:25:57.0

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

Industry News | 2014-05-05 16:29:24.0

Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).

Engineered Materials Systems, Inc.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-04-22 11:52:53.0

Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Industry News | 2018-03-12 17:42:02.0

Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.

Engineered Materials Systems, Inc.

Krayden and Dow Corning Introduce New Products for the LED Marketplace

Industry News | 2008-11-18 17:11:36.0

DENVER � November 2008 � Krayden, Inc., a leading distributor of engineered materials, along with Dow Corning, a global leader in silicone technology, introduce a new family of products for the LED marketplace.

Krayden Inc.

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