Industry News: moisture barrier bag zipper (Page 1 of 1)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Blue Thunder Technologies Offers ESD Products

Industry News | 2008-02-06 18:44:36.0

EAST WINDSOR, CT � February 6, 2008 � Blue Thunder Technologies Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it has numerous ESD products available.

Blue Thunder Technologies, Inc.

VJ Electronix Teams with AccuAssembly to Offer an Innovative New Component Reel Counting Technology at SMTAI

Industry News | 2014-09-27 08:19:04.0

VJ Electronix,Inc.and AccuAssembly, Inc.announces the new XQuik with AccuCount Technology.

VJ Electronix

Techcon Systems to Show New Hot Melt Jet Valve at NEPCON South China

Industry News | 2016-08-24 20:25:35.0

Techcon Systems will exhibit in Booth # 1H55 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Company representatives will showcase the new TS9300HM Hot Melt Jet Valve as well as Techcon Systems’ lineup of industry-leading valves.

Techcon Systems

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