Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2007-02-14 15:40:22.0
New ThermaSim Is First Online Simulation Tool to Use Finite Element Analysis Models for Increased Accuracy
Industry News | 2004-08-09 16:13:02.0
Two new common-drain, chipscale power MOSFETs that are the industry�s first such p-channel and 30-V n-channel devices were announced today by Siliconix incorporated.
Industry News | 2020-12-29 19:46:07.0
New Ultrafast Rectifiers Feature Unique Combination of Low Conduction and Switching Losses
Industry News | 2020-12-29 19:48:43.0
Ultra Durable Preassembled Power Distribution Equipment offering Single or Multiple Mechanical Interlocks
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
Industry News | 2011-01-11 13:37:34.0
Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
Industry News | 2021-09-15 10:52:35.0
Vishay Precision Performance Resistor Series Significantly Reduces Board Space and Component Counts by Replacing Larger Resistors
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
