Industry News: mould (Page 1 of 3)

Package Provides Integrated Hall-effect Solution

Industry News | 2003-05-30 08:09:11.0

A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.

SMTnet

Coding Profiles Eliminate Mismating

Industry News | 2003-07-08 09:22:20.0

A new range of coding profiles for Combicon wire-to-board connectors aims to avoid the pitfalls of inserting the wrong plug into a header when making plug-in connections to a PCB.

SMTnet

Spacers Provides PCB Hinges

Industry News | 2003-04-22 08:01:54.0

Two new additions to Heyco's range of PCB accessories are the SHCBS and SRF series of nylon circuit board spacers which, when used as a pair, provide a secure hinging mechanism for a mounted PCB.

SMTnet

Proposed Merger of Beyonics and Flairis Announced

Industry News | 2003-03-25 08:31:07.0

On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.

SMTnet

For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

SMTnet

Halogen-free / Lead-free Printed Circuit Boards

Industry News | 2018-10-18 11:06:26.0

Halogen-free / Lead-free Printed Circuit Boards

Flason Electronic Co.,limited

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

TMV the Second Generation of PoP

Industry News | 2013-01-19 05:42:49.0

Through Mould Via (TMV) is referred to as a second generation package on package device developed by AMKOR and incorporated into many of the leading mobile devices. The process of assembly provides some challenges event to those using the traditional PoP devices.

ASKbobwillis.com

X-ray Inspection: High-Contrast|Detector Investigates Non-Conductive Die-Attach

Industry News | 2001-06-05 06:09:32.0

The X-ray inspection of non-conductive die-attach has been not feasible using the customary real time image technique. This has changed now with the launch of the new high-contrast|detector by phoenix|x-ray.

phoenix|x-ray Systems

MYDATA appoints new Managing Director in China

Industry News | 2008-10-08 16:07:03.0

Pelle Wennerlund has been appointed Managing Director of MYDATA in the China region. The appointment will further strengthen MYDATA's on-going expansion in China, an increasingly important market for the leading supplier of high performance SMT equipment.

Mycronic AB

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