Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2003-07-08 09:22:20.0
A new range of coding profiles for Combicon wire-to-board connectors aims to avoid the pitfalls of inserting the wrong plug into a header when making plug-in connections to a PCB.
Industry News | 2003-04-22 08:01:54.0
Two new additions to Heyco's range of PCB accessories are the SHCBS and SRF series of nylon circuit board spacers which, when used as a pair, provide a secure hinging mechanism for a mounted PCB.
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2013-01-19 05:42:49.0
Through Mould Via (TMV) is referred to as a second generation package on package device developed by AMKOR and incorporated into many of the leading mobile devices. The process of assembly provides some challenges event to those using the traditional PoP devices.
Industry News | 2001-06-05 06:09:32.0
The X-ray inspection of non-conductive die-attach has been not feasible using the customary real time image technique. This has changed now with the launch of the new high-contrast|detector by phoenix|x-ray.
Industry News | 2008-10-08 16:07:03.0
Pelle Wennerlund has been appointed Managing Director of MYDATA in the China region. The appointment will further strengthen MYDATA's on-going expansion in China, an increasingly important market for the leading supplier of high performance SMT equipment.
Industry News | 2014-09-18 18:22:57.0
FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.
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