Industry News | 2023-09-04 14:29:02.0
Koh Young will be highlighting its revolutionary solutions at Productronica India 2023 with NMTronics India from 13-15 September 2023. There will be two machines covering automated pin inspection and dispense process inspection. Koh Young designed both to solve the difficult challenges faced in various production environments. Experience our latest solutions in the NMTronics booth PD01 Hall 4 or in the Panasonic Connect booth PB01 Hall 4 at BIEC, Bengaluru, India.
Industry News | 2016-02-24 15:04:42.0
Coming off a highly successful global launch at Productronica in November, the MPM Edison printing system makes its North American debut at this year's Apex show. As the next generation in printing technology, with patented features throughout its design, the Edison operates at twice the speed and with 25% more accuracy than other printers. With an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, the Edison is capable of reducing your total cycle time by as much as 15 seconds as compared to competitive printers (includes stencil wipe and printing).
Industry News | 2018-04-24 08:14:27.0
Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that PAC Global Inc. and Competitive Edge Manufacturing Equipment (CEME) have joined the Saki America team in the Southern United States and Mexico. The companies are representing Saki's complete line of 2D and 3D automated solder paste, automated optical, and automated x-ray (SPI, AOI, and AXI) inspection and measurement systems and software and Saki's Smart manufacturing, Industry 4.0, and machine-2-machine initiatives.
Industry News | 2017-10-12 15:01:31.0
Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
Industry News | 2021-03-12 04:57:42.0
CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with Multi-Reflection Suppression™ (MRS™) sensor technologyat SEMICON China,scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre, hall N1, booth 1387 and 1325. The company also will demonstrate high-precision WaferSense® sensors for semiconductor tool setup and diagnostics.
Industry News | 2002-04-08 08:32:45.0
Regional Powerhouses Team Up to Deliver Tecnomatix eMPower Solutions to Rapidly Growing Asian Electronics Manufacturing Market
Industry News | 2014-04-22 13:36:21.0
ASC International announces that its products will be showcased in two booths at NEPCON China 2014, scheduled to take place April 23-25, 2014 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2019-08-19 12:23:12.0
Viscom plans to exhibit at SMTA International and highlight the S3088 ultra chrome in Booth #315. The system is designed to meet the demand for high throughput production lines, inspect the most leading-edge electronics and be cost competitive.
Industry News | 2014-07-28 21:55:58.0
Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China.
