Industry News: mpm ultra print (Page 3 of 50)

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

Industry News | 2022-11-21 15:50:26.0

ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.

ITW EAE

ITW EAE Camdenton Missouri Manufacturing Site Receives ISO 9001-2015 Certification

Industry News | 2017-03-30 19:49:54.0

ITW EAE has achieved International Organization for Standardization (ISO) 9001-2015 certification for its Camdenton, Missouri manufacturing site. ISO 9001 is the world’s most widely recognized Quality Management System and helps organizations to meet the expectations and needs of their customers.

ITW EAE

ITW EAE Wins Global Technology Award for the Camalot Prodigy's Dynamic Dual Head Dispensing Technology

Industry News | 2020-04-14 18:17:46.0

ITW EAE has earned a coveted Global Technology Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented to Camalot Prodigy Business Manager, Hugh Reed and Engineering Manager Scott Reid during a ceremony at Productronica in Munich Germany.

ITW EAE

ITW EAE Wins VA Excellence Award for the Camalot Prodigy’s Dynamic Dual Head Dispensing Technology

Industry News | 2019-05-01 20:22:28.0

ITW EAE is proud to announce that it has earned a coveted VA Excellence Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented during the 13th Vision Awards program at Nepcon China.

ITW EAE

Camalot Announces PCB Temperature Monitoring on Prodigy Dispenser to Ensure Underfill Process Stability

Industry News | 2020-04-14 18:28:48.0

ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.

ITW EAE

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

SMTA Introduces Ultra High Density Interconnect (UHDI) Symposium

Industry News | 2024-02-12 14:07:03.0

The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Density Interconnect Symposium will be held at the Peoria Sports Complex.

Surface Mount Technology Association (SMTA)

ITW EAE Receives Patent No. 10,434,537 for Camalot® Prodigy's™ Dynamic Dual Head™ Dispensing Technology

Industry News | 2020-04-14 18:22:06.0

The U.S. Patent and Trademark Office has issued Patent No. 10,434,537 protecting Dynamic Dual Head™ (DDH) dispensing technology for the Camalot® Prodigy™ Dispenser. The Prodigy Dispenser employs breakthrough technology that delivers high-speed, extremely accurate materials dispensing for electronics assembly and packaging with tighter tolerances, and higher yields.

ITW EAE

Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020

Industry News | 2020-04-14 18:49:39.0

EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.

ITW EAE

Session Two of the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference to Focus on Ultra-Thin and Nano-Coatings

Industry News | 2014-10-16 19:22:45.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.

Association Connecting Electronics Industries (IPC)


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