Industry News: msl 2 bakeout (Page 1 of 3)

Logistics Firms Grabbing More EMS Business

Industry News | 2003-02-11 08:42:41.0

To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment

SMTnet

IPC Names New Director of PWB Standards And Technology

Industry News | 2001-12-19 10:50:53.0

IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.

Association Connecting Electronics Industries (IPC)

Phoenix International and MSL Embrace IPC EMS Program Manager Certification Program

Industry News | 2003-02-22 13:30:35.0

Trains all levels of program managers within the EMS industry in operations, project management, finance, contract management and leadership skills.

Association Connecting Electronics Industries (IPC)

First-Ever Power Conversion Standard IPC-9592 Gets Update

Industry News | 2010-06-11 15:59:00.0

BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

iNEMI Publishes Guidelines for Subassemblies in High-Reliability Applications

Industry News | 2006-06-23 16:19:47.0

Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules

iNEMI (International Electronics Manufacturing Initiative)

Saline Lectronics Installs the ISM2000 Intelligent Storage Solution

Industry News | 2015-07-13 21:13:09.0

Storagesolutions is pleased to announce that Saline Lectronics, has purchased and installed an ISM2000 Intelligent Storage Management machine, with sales and service by Juki. Saline Lectronics is a leading electronics contract manufacturer based in Saline, MI that runs five Juki lines. The ISM2000 will support the Juki lines by ensuring that materials are in the right place at the right time.

Saline Lectronics, Inc

Indium Corporation Features 'Power-Safe' NC-SMQ®75 Die-Attach Solder Paste at SEMICON China

Industry News | 2016-02-20 20:36:54.0

Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.

Indium Corporation

Meet Seika Machinery at the 2012 IPC APEX Expo for a Glimpse into Its World Renowned Storage Cases and Equipment

Industry News | 2012-01-21 17:15:20.0

Seika Machinery will showcase its proven, advanced machinery in Booth #2401 at the upcoming IPC APEX Expo.

Seika Machinery, Inc.

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