Industry News: msl 3 baking (Page 1 of 6)

Logistics Firms Grabbing More EMS Business

Industry News | 2003-02-11 08:42:41.0

To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment

SMTnet

IPC Names New Director of PWB Standards And Technology

Industry News | 2001-12-19 10:50:53.0

IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.

Association Connecting Electronics Industries (IPC)

SMTA Calendar of Events

Industry News | 2003-04-24 08:16:54.0

http://www.smta.org/news/smta_calendar/calendar.cfm

Surface Mount Technology Association (SMTA)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

XDry Introduces the XDry M.O.L.E.

Industry News | 2009-10-16 16:10:36.0

User-Configurable Process Audit Tool

XDry

Essemtec's Tower Increases Variosystems’ Flexibility of Production

Industry News | 2011-02-26 16:00:45.0

Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor

ESSEMTEC AG

Circuit Technology Center Announces New Component Trim and Form Service

Industry News | 2023-11-13 12:31:47.0

Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Circuit Technology Center, Inc.

Seika to Highlight Leading Equipment at SMTAI 2009

Industry News | 2009-09-17 14:59:53.0

TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight Sayaka’s Table-Top Router, Hirox’s 3-D Microscope and the McDry MB-302 Low Temp Baking Cabinet in booth 617 at the upcoming SMTA International exhibition and conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

Seika Machinery, Inc.

Seika Machinery, Inc. to Debut New McDry Products and Features at IPC APEX EXPO

Industry News | 2011-02-14 14:41:46.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Seika Machinery, Inc.

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