Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2003-02-22 13:30:35.0
Trains all levels of program managers within the EMS industry in operations, project management, finance, contract management and leadership skills.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2003-04-03 08:37:55.0
Leading Global EMS Company Exchanges Its Current Design-to-Assembly Workflow With the Trilogy 5000 Technology Backbone for Manufacturing
Industry News | 2018-11-27 14:03:14.0
Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.
Industry News | 2020-12-22 12:31:35.0
Automotive Grade PIN Photodiodes in 0805 Case Size Feature Low 0.7 mm Profile, Black SMD Packages to Eliminate Side Illumination and Increase Signal to Noise Ratio for Solar Load Sensors; Automotive Rain, Light, and Tunnel Sensors
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2010-10-29 22:49:13.0
FCT Assembly announces that it has reached a new level of stability and reliability with its new line of no-clean, halogen-free solder pastes. The pastes have a shelf life of nine months when stored properly and can be stored at room temperature with excellent results for up to one month.
Industry News | 2021-02-09 11:00:27.0
New Vishay VEMD8081 High Speed PIN Photodiode Enables Improved Bio Sensor Performance, Slim Design for Wearables
Industry News | 2008-07-24 16:21:26.0
NASHVILLE � July 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that its MICRONOX� MX2628 Aqueous Cleaner for Advanced Packaging has won the Attendee's Choice Award in the Lowest Cost of Ownership category among �Final Manufacturing� products. The award presentation took place July 16, 2008 on the show floor of the SEMICON West 2008 exhibition. Kyzen highlighted MX2628 in booth 7514 on Level 1 of the West Hall.
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