Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2020-12-10 14:16:32.0
New Automotive Grade Proximity Sensor from New Yorker Electronics Delivers High Resolution Up to 20µm for Force Sensing in Automotive, Consumer and Industrial Applications
Industry News | 2020-12-29 19:51:24.0
New Automotive Grade Proximity Sensor from New Yorker Electronics Delivers High Resolution Up to 20µm for Force Sensing in Automotive, Consumer and Industrial Applications
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