Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2019-02-09 20:20:00.0
In recognition of their significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, long-time IPC volunteers, Bhawnesh Mathur; Mark Wolfe, John Deere Electronic Solutions; and Udo Welzel, Robert Bosch GmbH, were presented with an IPC President’s Award at IPC APEX EXPO 2019.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2012-05-01 08:44:43.0
New IPC President and CEO John Mitchell started his first week on the job at the association that, 55 years ago, helped a newly formed printed wiring board industry gain acceptance, strength and visibility
Industry News | 2017-05-16 17:59:37.0
PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Industry News | 2001-11-27 13:09:48.0
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2020-02-12 23:58:35.0
IPC bestowed its highest corporate honors on two IPC member companies, TTM Technologies, Inc. and Continental Automotive. During a luncheon at IPC APEX EXPO 2020, the Peter Sarmanian Corporate Recognition Award was presented to TTM Technologies, Inc. and the Stan Plzak Corporate Recognition Award was presented to Continental Automotive.
