Industry News: multi-layer (Page 1 of 10)

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Congresswoman Sinema Tours Isola Group

Industry News | 2014-01-08 18:09:35.0

Congresswoman Kyrsten Sinema (AZ-9) visited Isola's manufacturing and R&D facilities in Chandler, Arizona on Friday, January 3 to learn about the issues that concern the developer and manufacturer of materials used to fabricate advanced printed circuit boards.

Association Connecting Electronics Industries (IPC)

IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

Industry News | 2016-04-07 08:47:23.0

The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

Association Connecting Electronics Industries (IPC)

Pan Pacific Microelectronics Symposium Program Finalized

Industry News | 2019-12-11 16:04:23.0

SMTA announced that the program is finalized for the 25th Annual Pan Pacific Microelectronics Symposium. The event will take place February 10-13, 2020 at the Westin Hapuna Beach Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Surface Mount Technology Association (SMTA)

Microvias and Laser Technology Focus of IPC Printed Circuitd Expo 2002 Workshops

Industry News | 2001-11-27 13:09:48.0

IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.

Association Connecting Electronics Industries (IPC)

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

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