Industry News: multicore (Page 12 of 12)

New Yorker Electronics introduces newest Novasom M Series of SBCs

Industry News | 2021-01-14 11:17:14.0

Novasom Industries Single Board Computer Boasts excellent Graphics Capabilities (4K) with high Flexibility in Connecting Displays like eDP, HDMI, MIPI and Other Units

New Yorker Electronics

Third generation British manufacturer GEN3 Systems celebrates 50 years in business

Industry News | 2022-11-02 14:16:38.0

GEN3 recently celebrated, with all its staff, the and me Second50th anniversary of the business founded by Arthur Naisbitt in 1969. The celebration had to be postponed by 3 years due to the Global Covid Pandemic.

Gen3 Systems

Heraeus Electronics, MacDermid Alpha Electronics Solutions and Henkel Win Patent Infringement Lawsuit Against Senju Group

Industry News | 2024-04-08 14:13:51.0

Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju's infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

Heraeus

NEPCON China 2010 Steps into Spring

Industry News | 2010-04-14 20:35:47.0

Professional exhibition is generally the barometer of industry development. As one of the largest professional exhibitions of the Chinese electronics manufacturing and surface mount industry, NEPCON China undoubtedly reflects the reality of the electronics manufacturing industry climate in China. The continuous downturn of the global economy since 2008 frustrates many vendors in the industry in respect to the future of the market. In 2009, the economy in China grew successfully by more than 8 percent. In 2010, China will make further adjustments to industrial structure while keeping sustainable economic growth. Based on this, what is the future of the electronics manufacturing industry? Visitors will obtain personal experience at NEPCON China 2010, which will be held on April 20, 2010 in Shanghai.

Reed Exhibitions

ASSET is first to support Intel’s new Nehalem micro-architecture and Tolapai SOC with CPU emulation test and diagnostics

Industry News | 2008-06-19 11:24:03.0

MicroMaster gives circuit board designers and manufacturing engineers functional test and diagnostic capabilities

ASSET InterTech, Inc.

Mentor Graphics Embedded Linux Platform Achieves Yocto Project 1.3 Compatibility

Industry News | 2012-11-11 22:30:15.0

Continuing its commitment to open source development, Mentor Graphics announced the newest release of its Yocto Project™ 1.3-compatible Mentor® Embedded Linux platform. With this release, Mentor Graphics furthers its commitment to provide embedded developers with solutions to harness the capabilities of open source technology and to create customized, yet commercially supported, embedded Linux platforms.

Mentor Graphics

Gen3 Systems announces an entirely new design of the CM Series at productronica

Industry News | 2015-10-21 20:30:02.0

Gen3 Systems Limited is pleased to introduce a totally new design of the Contaminometer (CM Series Process Ionic Contamination Testers) it will be released in Hall A4, Booth 470 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Gen3 will be exhibiting alongside its German Distributor, Stannol GmbH.

Gen3 Systems

ADLINK Announces its First COM Express® 3.0 Type 7 Computer-on-Module

Industry News | 2016-08-02 13:02:42.0

ADLINK Technology announced its first computer-on-module (COM) based on the latest PCI Industrial Computer Manufacturers Group (PICMG®) COM Express® 3.0 specification with new Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10 Gigabit Ethernet (GbE) capabilities to a COM form factor. ADLINK’s Express-BD7 targets customers building space-constrained systems in industrial automation and data communication, such as virtualization, edge computing or other numerical applications, that require high density CPU cores balanced by reasonable power consumption.

ADLINK Technology, Inc.

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