Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Industry News | 2013-06-20 09:32:20.0
Nihon Superior Co., Ltd., announces that Keith Sweatman was invited to speak at the SMART Group European Conference on behalf of its UK distributor DKL Metals Ltd.
Industry News | 2013-09-10 14:47:43.0
SMART Group announces that its annual SMART Group European Conference & Table Top Exhibition will be held from 2-3 October 2013 at the Spread Eagle Hotel in Cornmarket Thame, Oxfordshire, England.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2009-05-15 13:56:51.0
May 2009 � The Balver Zinn Group announces the appointment of Tim Lawrence PhD, a Product Development Manager with a consistent track record of process and product innovation, as well as patent coverage and commercialization.
Industry News | 2010-10-01 00:47:32.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Sweatman will present a paper titled “The Development of an Improved Tin-Zinc Solder” at the upcoming SMTA International
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
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