Industry News: multilayer bonding (Page 1 of 3)

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

PNC Inc. Acquires New Horizontal Oxide Line

Industry News | 2014-12-12 12:24:17.0

PNC Inc. has obtained a new Horizontal Conveyorized CO-BRA BOND In-line Oxide Replacement line from IPS (Integrated Process Systems). The machine is capable of coating 100 panels per hour to help expedite the inner layer treatment process. Compared to the previous process of manual dip tanks, the Oxide Replacement line is far more efficient due to automation. By using fewer heaters, the new unit is more energy efficient as well.

PNC Inc.

Würth Elektronik Expands its Service Portfolio

Industry News | 2013-06-03 11:00:12.0

The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.

Würth Elektronik GmbH & Co. KG

Gen3 and Finetech GmbH & Co.KG to Exhibit at the iPower4 Conference

Industry News | 2022-11-21 15:48:35.0

Gen3 will exhibit at the iPower4 Conference, scheduled to take place Thursday, Nov. 24, 2022 at Jubilee Conference Centre at the University of Nottingham.

Gen3 Systems

Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Industry News | 2014-11-18 18:10:25.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.

Nordson DAGE

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

Viscom implements groundbreaking 3D technology across its entire product range

Industry News | 2018-11-14 15:34:52.0

Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.

Viscom AG

Nordson DAGE Launches X-Plane™ at Productronica

Industry News | 2011-11-27 00:51:50.0

Nordson DAGE launched X-Plane™ at the Productronica show.

Nordson DAGE

PFC Flex meets high speed application requirements

Industry News | 2010-06-28 19:23:30.0

PFC Flexible Circuits Qualifies New, High Speed DuPont™ Pyralux® TK Flexible Circuit Material

PFC Flexible Circuits Limited

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