Industry News: multilayer bonding (Page 2 of 3)

OAK MITSUI EXPANDS PARTNERSHIP NAMING INSULECTRO EXCLUSIVE DISTRIBUTOR OF ALL ABC AND COPPER FOILS

Industry News | 2016-05-21 08:04:11.0

Oak-Mitsui are proud to announce an expanded strategic partnership adding Oak Mitsui’s proprietary ABC (aluminum bonded copper) to Insulectro’s premier product portfolio including CAC (copper aluminum copper). By leveraging their bicoastal manufacturing locations, ABC will continue to manufacture its bonded product in Hoosick Falls, NY and Insulectro will continue to manufacture CAC at its facility in Lake Forest, CA. The complete line of Oak-Mitsui copper foils, on CAC and ABC, will be available in Insulectro’s inventory by June 17, 2016.

Oak Mitsui Inc.

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Insulectro, Oak-Mitsui, CAC Inc Create Landmark Partnership

Industry News | 2015-06-22 13:17:54.0

Insulectro (www.insulectro.com), a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.

INSULECTRO

One article take you to know AL-based board

Industry News | 2019-11-05 22:10:56.0

Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.

Headpcb

Dage to exhibit XD7600NT digital x-ray inspection system at SMTA International

Industry News | 2008-08-14 15:35:26.0

August 12, 2008, Fremont, California � Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in x-ray inspection technology, announces that it will exhibit its XD7600NT digital x-ray inspection system in Booth No. 501 at the SMTA International show scheduled to take place in Orlando, Florida on August 19-21, 2008.

Nordson DAGE

Dr. Evstatin Krastev of Nordson DAGE to Discuss 3D Board Level X-Ray Inspection during SMTA International

Industry News | 2012-09-17 16:02:44.0

Nordson DAGEa division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, International Applications Engineering Manager, will present a paper titled “3D board level X-Ray inspection via Limited Angle Computer Tomography” at the upcoming SMTA International Conference & Exhibition

Nordson DAGE

Isola Launches CAF Mitigation Technology-Licensing Program

Industry News | 2014-04-08 11:43:03.0

Isola Group has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA", reduces the number of voids in resin-impregnated dielectrics, which is a major source of CAF failures.

Isola Group

NIKON Metrology Showcases the Inspect-X 4.1 Which Provides Ultra-Sharp Images And Advanced BGA analysis at Electronica Munich

Industry News | 2014-10-13 16:23:05.0

Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.

Nikon Metrology, Inc.


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