Industry News: multilayer bonding (Page 3 of 3)

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Würth Elektronik offers the best contact between flex-rigid PCBs and ZIF connectors

Industry News | 2010-05-05 23:20:11.0

Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.

Würth Elektronik GmbH & Co. KG

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