Industry News: mydata and 2012 (Page 8 of 41)

IPC to Hold Inaugural Test and Inspection Online Symposium Case Studies, Technology Review Will be Presented

Industry News | 2012-06-29 17:09:10.0

Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.

Association Connecting Electronics Industries (IPC)

IPC Offers Three One-day Seminars on Conflict Minerals Critical Issues Experts to present strategies and tools needed for compliance

Industry News | 2012-09-17 16:19:57.0

IPC — Association Connecting Electronics Industries® will hold three, one-day seminars, “Conflict Minerals Critical Issues,” on October 24, 2012, in Boston, Mass.; November 1, 2012,

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Karen McConnell and Linda Woody Receive IPC Presidents Award Award Presented for their Contributions to IPC and the Electronics Industry

Industry News | 2013-03-04 16:08:13.0

IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.

Association Connecting Electronics Industries (IPC)

New IPC President and CEO Begins Tenure with Promise to Accelerate Services to Support Membership

Industry News | 2012-05-01 08:44:43.0

New IPC President and CEO John Mitchell started his first week on the job at the association that, 55 years ago, helped a newly formed printed wiring board industry gain acceptance, strength and visibility

Association Connecting Electronics Industries (IPC)

Cleaning, Military and Printed Electronics, Solderability and Reliability Highlight IPC APEX EXPO Technical Conference 35 technical sessions with nearly 100 research papers

Industry News | 2012-12-14 06:50:53.0

e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

Association Connecting Electronics Industries (IPC)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Executive Management Meetings at IPC APEX EXPO Spotlight Key Opportunities, Environmental Issues and International Trends

Industry News | 2012-01-13 13:13:13.0

Before the action begins at IPC APEX EXPO 2012, executives will gather for the IPC EMS Management Council Meeting and the IPC PCB Executive Management Meeting. These exclusive events, taking place February 27 at the San Diego Convention Center, will focus on the strategic business issues unique to senior-level decision makers in the PCB and EMS industries.

Association Connecting Electronics Industries (IPC)

IPC Midwest Spotlights New Resources and Solutions to Reliability Challenges in Electronics Manufacturing Registration Now Open

Industry News | 2012-05-15 10:31:04.0

IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)


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