Industry News: name (Page 10 of 133)

International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2015-04-07 15:57:40.0

SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Surface Mount Technology Association (SMTA)

Symposium on Counterfeit Parts and Materials Call for Abstracts

Industry News | 2016-02-03 18:16:18.0

The SMTA is pleased to announce the Call for Abstracts for the Symposium on Counterfeit Parts and Materials June 28-30, 2016 College Park, Maryland. The deadline to submit an abstract is March 7, 2016.

Surface Mount Technology Association (SMTA)

SMTA and CALCE Seeking Abstracts for 2nd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2016-04-12 15:29:42.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 29 - December 1, 2016 at the Crowne Plaza Midtown in Atlanta, GA.

Surface Mount Technology Association (SMTA)

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2017-05-30 19:40:07.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.

Surface Mount Technology Association (SMTA)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

How to Export Gerber Files from Eagle

Industry News | 2018-10-18 09:45:34.0

How to Export Gerber Files from Eagle

Flason Electronic Co.,limited

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Industry News | 2018-10-18 11:18:14.0

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Flason Electronic Co.,limited

IPC Continues Strong Support of North American Electronics Industry

Industry News | 2003-05-13 08:01:13.0

Nearly 300 companies have already contracted space at the co-located IPC Printed Circuits Expo� and IPC SMEMA Council�s APEX� exhibition and conference, taking place February 24-26, 2004, at the Anaheim Convention Center in Anaheim, Calif.

Association Connecting Electronics Industries (IPC)

Global Business Outlook Keynote at IPC APEX EXPO Highlights Economic Recovery

Industry News | 2011-03-03 19:03:37.0

IPC Director of Market Research Sharon Starr's latest reports show signs of an uneven economic recovery in the electronics manufacturing industry with pronounced geographic and sector differences. She will co-present this industry data and more at the Global Business Outlook Keynote with noted industry analyst Walt Custer, president of Custer Consulting Group, on Wednesday, April 13, 2011, at IPC APEX EXPO™ in Las Vegas.

Association Connecting Electronics Industries (IPC)


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