Industry News | 2009-06-23 19:29:41.0
COLORADO SPRINGS, CO — May 2009 — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display several advanced systems in booth 817 at the upcoming SEMICON West exhibition, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Calif.
Industry News | 2009-12-07 18:05:13.0
Breda, Holland - Cobar BV, a member of the Balver Zinn Group, announces the launch of a whole new range of VOC-free and Low-VOC fluxes at Productronica. Being showcased in Stand 570 in Hall A4, these RoHS compliant fluxes fulfil the need for more environmental-friendly materials, maintaining excellent soldering performance. The event is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2010-06-21 15:37:50.0
COLORADO SPRINGS, CO — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display several advanced systems for handling wafers and solar cells in booth 5771 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2011-05-16 16:00:12.0
Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.
Industry News | 2011-09-12 15:45:51.0
JTAG Technologies is pleased to announce the immediate release of a new JTAG/boundary-scan hardware interface product compatible with the MAC-Panel ‘Scout’ mass interconnect system. The JT 2147/DAK is a signal conditioning module that allows seamless connections from JTAG Technologies PXI DataBlaster to the Scout’s connection system.
Industry News | 2014-05-20 23:43:21.0
"Our New Test Dimensions to Ride Your Products' Innovation". Seica's participation in this exhibition will address all dimensions of board test, from prototype to mass production, to field repair, implemented on a variety of solutions, based on a common hardware and software core, but focused at your environment, performance, efficiency and cost requirements.
