Industry News: ni free (Page 4 of 11)

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

MacDermid Alpha to Exhibit and Promote Latest Technology at Semicon Taiwan

Industry News | 2021-12-17 16:40:06.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for the emerging semiconductor market at the Semicon Taiwan, Taipei City, December 28-30, 2021 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

MacDermid Alpha Electronics Solutions

Nihon Superior to Exhibit at Internepcon Japan 2012

Industry News | 2011-12-14 15:03:10.0

Nihon Superior will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder in booth East 30-13 at the upcoming Internepcon Japan exhibition. SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability.

Nihon Superior Co., Ltd.

Nihon Superior USA to Introduce SN100C P500 Soldering Paste in Booth 249 at APEX 2008

Industry News | 2008-03-01 19:33:42.0

Nihon Superior�s unique SnCuNiGe solder, SN100C�, that has established itself as the best alloy for lead-free wave soldering, will now be available as a high-performance solder paste with a general purpose �P500� flux medium.

Nihon Superior Co., Ltd.

Nihon Superior Brings Cutting-edge Pastes to the IPC APEX EXPO

Industry News | 2014-02-19 16:03:57.0

Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Nihon Superior Co., Ltd.

Nihon Superior and DfR Solutions� Lead-free Solder Reliability Paper to be Presented at IPC/JEDEC International Conference

Industry News | 2008-03-09 00:07:32.0

OSAKA, JAPAN � March 6, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper with DfR Solutions, titled �Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,� to the Technical Conference that is part of the IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics scheduled to take place March 11, 2008 at the Sheraton Raleigh Hotel in Raleigh, North Carolina.

Nihon Superior Co., Ltd.

Nihon Superior’s Keith Sweatman to Present at TMS 2011

Industry News | 2011-03-01 16:38:55.0

Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.

Nihon Superior Co., Ltd.

Study Conducted by Nihon Superior Demonstrates Value of Collaborative Research with University of Queensland

Industry News | 2011-11-03 20:55:23.0

Nihon Superior announces that the research it is funding at the University of Queensland has been cited as a demonstration of the value of such collaboration.

Nihon Superior Co., Ltd.

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

Industry News | 2014-08-26 16:19:51.0

Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Nihon Superior Co., Ltd.

FCT Assembly Develops Anti-tombstoning Paste Formulation

Industry News | 2014-02-03 14:13:04.0

FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.

FCT ASSEMBLY, INC.


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