Industry News | 2019-02-06 01:46:45.0
PARENTNashik, resistance welding consumables, spares manufacturer & exporter in Nashik, India, today announced the relocation of its existing production unit to new space to accommodate the rapid growth and future expansion plans to help Indian, European & US customers.
Industry News | 2022-01-10 16:49:36.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Industry News | 2008-02-28 13:52:30.0
COLORADO SPRINGS, CO � February 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2010-02-08 12:16:04.0
DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year’s Electronics Next exhibition in conjunction with the company’s agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501.
Industry News | 2015-06-08 13:50:26.0
FCT Companies, a leading chemistry, electronic stencil and specialty manufacturing business, announces the official opening of its new state-of-the-art facility in Guadalajara, Mexico. While FCT has long had a significant presence in Mexico through sales, service and distribution, the company’s Fine-Line Stencil operation in Guadalajara marks its first manufacturing site in the region and is a noteworthy addition to the broad FCT offering.
Industry News | 2017-01-24 18:34:21.0
NEO Tech announces that six Lithium-Ion Battery Orbital Replacement Units (ORUs) that it assembled for Aerojet Rocketdyne were launched into space for the International Space Station on December 9, 2016, with the first three successfully installed in the International Space Station January 6, 2017. The new battery cell used in the ORUs is a third-generation of Li-ion cell that is designed specifically for space.
Industry News | 2009-08-19 19:55:21.0
EAST WINDSOR, CT — August 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that its GREEN MONSTER formulation has the abrasion resistance to withstand the high friction caused by the wiping action, the integrity to resist fibers from being pulled off by sticky solder paste, and the toughness to withstand the harsh scraping and grating action caused by the stencil’s apertures.
Industry News | 2017-12-05 14:37:56.0
Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.
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