Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
Industry News | 2012-01-26 22:34:41.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2026-02-16 15:49:26.0
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 2-5 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ. The KYZEN clean team member Scott Cain will be on-site at Booth #108 providing information about power electronics cleaning chemistries MICRONOX MX2120-LF, MX2123, and MX2127.
Industry News | 2025-06-30 20:42:24.0
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon, scheduled to take place July 7-10 at the San Jose Marriott. KYZEN's advanced packaging cleaning expert Scott Cain will be on-site to provide information about power module cleaning chemistries MICRONOX MX2123 and MX2127.
Industry News | 2014-09-18 18:22:57.0
FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.
Industry News | 2010-04-09 21:17:21.0
Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.
Industry News | 2025-09-08 19:53:50.0
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona. Attendees are invited to visit Booth 936 to explore KYZEN's cutting-edge MICRONOX® cleaning solutions engineered for today's most advanced and sensitive semiconductor applications.
