Industry News | 2011-04-07 20:43:37.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell, Technical Director, will present a paper titled "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly" at the upcoming International Conference on Soldering & Reliability (ICSR).
Industry News | 2012-05-10 20:09:28.0
AIM, will highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 16:42:36.0
AIMwill highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.
Industry News | 2013-09-10 15:43:26.0
HARTING AG is increasingly using 3-D molded interconnect device (MID) technology for its customers in the automotive and medical technology sectors who demand very high quality.
Industry News | 2015-10-21 15:33:36.0
Nihon Superior Co. is pleased to announce that its 50-year anniversary celebration will take place Oct. 23, 2015 at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration will kick off on Oct. 22 with a sightseeing tour to Kyoto, followed by the anniversary ceremony on Oct. 23, and will conclude with a sightseeing tour to Hyogo prefecture (Kobe) on Oct. 24.
Industry News | 2019-10-26 15:12:49.0
Nathan Trotter announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Bar & Wire for its NT100Ge. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2019-11-13 11:29:06.0
Nathan Trotter announces that it was awarded a 2019 Global Technology Award in the category of Solder Bar & Wire for its NT100Ge Solder Bar & Wire. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
Industry News | 2014-09-18 18:22:57.0
FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.
Industry News | 2012-04-17 11:22:21.0
AIM will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
