Industry News | 2024-05-20 10:37:16.0
KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.
Industry News | 2012-05-10 20:09:28.0
AIM, will highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 16:42:36.0
AIMwill highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.
Industry News | 2013-04-22 16:20:52.0
FCT Assembly announces that it has developed a new low-melting Tin/Bismuth solder paste – NC722.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-01-18 04:01:33.0
Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.
Industry News | 2010-10-29 22:49:13.0
FCT Assembly announces that it has reached a new level of stability and reliability with its new line of no-clean, halogen-free solder pastes. The pastes have a shelf life of nine months when stored properly and can be stored at room temperature with excellent results for up to one month.
Industry News | 2004-09-29 21:38:11.0
Frenchtown, NJ, September 2004
Industry News | 2010-09-29 01:30:07.0
FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
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