Industry News: nickel soldering (Page 8 of 14)

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

Environmentally Responsible / Operator Safe Stencil Cleaning

Industry News | 2007-11-08 19:31:27.0

Simple Green� Stencil and Misprint Cleaner is specifically designed to remove all SMT solder pastes including Resin, Water-Soluble, No-Clean, Lead and Lead-Free from stencils, screens, and misprints.

Aqueous Technologies Corporation

AIM to Exhibit NC258 Lead-Free & Tin-Lead Solder Paste at SMTA Upper Midwest Expo & Tech Forum

Industry News | 2012-05-31 16:42:36.0

AIMwill highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.

AIM Solder

Nihon Superior Receives SN100C 10-Year Anniversary Plaque at NEPCON China 2009

Industry News | 2009-05-11 11:46:12.0

OSAKA, JAPAN � May 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the global market, announces that Nihon Superior was awarded a plaque in honor of the company's 10th anniversary of its SN100C lead-free solder alloy. The award was presented by Reed China during the recent NEPCON China exhibition and conference that took place in Shanghai, China.

Nihon Superior Co., Ltd.

Nihon Superior Receives SN100C 10-Year Anniversary Plaque at NEPCON China 2009

Industry News | 2009-05-11 11:46:16.0

OSAKA, JAPAN � May 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the global market, announces that Nihon Superior was awarded a plaque in honor of the company's 10th anniversary of its SN100C lead-free solder alloy. The award was presented by Reed China during the recent NEPCON China exhibition and conference that took place in Shanghai, China.

Nihon Superior Co., Ltd.

Nihon Superior�s SN100C Wins 2008 SMT China Vision Award

Industry News | 2008-04-09 00:04:58.0

OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.

Nihon Superior Co., Ltd.

Nihon Superior President to Participate in NEPCON China Reflow Optimization Roundtable

Industry News | 2012-04-21 09:00:24.0

Nihon Superior, a supplier of advanced soldering materials to the global market is proud to announce that its President Tetsuro Nishimura has been invited to participate in a Roundtable discussion, “Optimizing Reflow of Lead-Free Boards and BGAs,” hosted by EMSNow.

Nihon Superior Co., Ltd.

AIM to Highlight NC258 Lead-Free & Tin-Lead Solder Paste at SMTA Toronto Expo & Tech Forum

Industry News | 2012-05-10 20:09:28.0

AIM, will highlight its NC258 Lead-Free & Tin-Lead Solder Paste at the upcoming SMTA Toronto Expo & Tech Forum,

AIM Solder

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation


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