Industry News: nickel tin plating (Page 1 of 18)

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Flex Circuits Can Be Supplied With Connectors

Industry News | 2003-04-09 08:25:50.0

A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.

SMTnet

PCB Test Point Provide Easy Component Access

Industry News | 2003-06-13 09:56:46.0

Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.

SMTnet

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

NEW IPC COMMODITIES REPORT PREDICTS RISING PRICE TREND TO RESUME IN 2013

Industry News | 2013-02-08 14:38:34.0

IPC — Association Connecting Electronics Industries® launched a new series of monthly market research reports this week with the publication of the February 2013 edition of IPC Commodities Report for the Electronics Industry.

Association Connecting Electronics Industries (IPC)

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