Industry News: nikon xtv 160 (Page 1 of 1)

Flextron Ensures Quality with Advanced 3D SPI, AOI Inspection

Industry News | 2018-03-11 11:38:15.0

Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.

FLEXTRON CIRCUIT ASSEMBLY

Metcal, Nikon and Nordson ASYMTEK to Co-Host BGA Rework and Repair and X-Ray Inspection Seminar at ACI Technologies in Philadelphia

Industry News | 2013-05-01 20:51:31.0

Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.

OK International

Electronic Manufacturer Solves Complex PCB INSPECTION Challenges using Nikon X-RAY SYSTEM

Industry News | 2017-05-15 15:57:19.0

Nikon Metrology has recently provided its high-precision, flat-panel based X-ray inspection system, XT V 160 to help Michigan company, Saline Lectronics inspect its most complex and challenging technical assemblies to the highest standard.

Nikon Metrology, Inc.

Altus Presents Nikon Metrology’s Latest Innovations

Industry News | 2016-11-30 16:32:39.0

Nikon Metrology’s latest innovations are now being represented by Altus Group, a leading distributor of capital equipment for the electronics assembly industry as part of their product portfolio in the UK and Ireland.

Altus Group

Saline Lectronics purchases Nikon Metrology X-ray System

Industry News | 2017-01-15 19:31:24.0

Saline Lectronics today announced that it has purchased and installed a Nikon Metrology XT V 160 Varian 1313Dx X.Tract PCB inspection system with the Advanced Service Kit, AutoTransformer, and Inspect-X Software. This new system will better enable Lectronics to provide customers with fast, automated 3D component inspection.

Saline Lectronics, Inc

BSU Inc. Updates High-Performance X-ray Inspection Capability

Industry News | 2021-05-10 02:50:10.0

BSU Inc. has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc...

BSU Incorporated

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