Industry News: no clean wave (Page 11 of 45)

SHENMAO Technology will attend AutoTronics Taipei 2018

Industry News | 2018-04-05 17:27:40.0

SHENMAO America today announced plans to exhibit in Booth L1101 at AutoTronics Taipei 2018, scheduled to take place April 11-14 at the Nangang Exhibition Center. The company’s new PF610-P250 solder paste, PF606-F101 solder wire and SMCW-3 cleaner are designed for automotive applications.

Shenmao Technology Inc.

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO

Industry News | 2022-10-11 17:22:18.0

SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.

Shenmao Technology Inc.

SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Process

Industry News | 2023-05-22 18:45:34.0

SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.

Shenmao Technology Inc.

Seika Sees Increased Interest in Sawa Mask Cleaner and Ecobrid Fully Automatic Stencil Cleaner

Industry News | 2022-02-07 17:10:04.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce that it has seen increased interest in the Sawa SC-MM7VE Screen Mask Cleaner and Sawa SC-AH100F Ecobrid Fully Automatic Stencil Cleaner. The increased popularity is due to fast tact time, closed-loop design and low solvent usage.

Seika Machinery, Inc.

MPM® EnclosedFlow™ Delivers Superior Fine Feature Printing, Major Paste Savings over Squeegee Blades

Industry News | 2013-05-11 22:01:39.0

The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

Speedline Technologies, Inc.

FSInspection Appoints Representative in Northern California

Industry News | 2015-03-09 21:12:49.0

FSInspection announces the appointment of MAN-TechSystems as its manufacturers’ representative for the FSInspection series in Northern California and Northern Nevada.

FSInspection

New Low-Temperature Solder Paste from SHENMAO

Industry News | 2018-06-17 16:55:59.0

SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

SHENMAO Hires Don Dennison as New East Coast Rep

Industry News | 2018-07-02 21:37:24.0

SHENMAO America, Inc. is pleased to announce the appointment of Mr. Don Dennison of PIT Equipment Services to be their manufacturer’s rep covering Southeastern New York, New Jersey and Eastern Pennsylvania.

Shenmao Technology Inc.

SHENMAO Provides New Solder Paste for Automobile Electronics

Industry News | 2019-05-13 17:42:18.0

SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

Shenmao Technology Inc.


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