Industry News: no clean wave (Page 44 of 45)

Juki to Debut FlexSolder S3532 Stamp Solder System at APEX 2009

Industry News | 2009-03-18 14:01:06.0

MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will premiere the FlexSolder S3532 in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

EVS International to Premier Innovative Solder Dross Recovery to Brazilian Market at FIEE

Industry News | 2013-03-21 09:14:58.0

EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.

EVS International

EVS International to Premier Innovative Solder Dross Recovery to Brazilian Market at FIEE

Industry News | 2013-03-27 16:51:17.0

EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE)

EVS International

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

Industry News | 2014-08-26 16:19:51.0

Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Nihon Superior Co., Ltd.

SolderStar Joins Industry Experts at Seminar to Address Profiling Techniques

Industry News | 2015-12-01 11:46:19.0

SolderStar joined industry experts from the electronics manufacturing sector to address the issues surrounding thermal profiling for today’s highly complex assemblies and discuss the way this impacts the manner in which the industry measures component temperatures accurately.

Solderstar

Hands on Master Class Series from Bob Willis

Industry News | 2017-03-06 05:20:47.0

For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk

ASKbobwillis.com

Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor

Industry News | 2019-01-23 17:29:28.0

Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA.

Indium Corporation

Z-AXIS Adds $1.2M in Equipment for Printed Circuit Board and Cable Assembly Services

Industry News | 2021-09-24 13:31:07.0

Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY

Z-AXIS, Inc.

Preview for AdoptSMT - SMT Nuremberg 2016, April 26-28, Stand 7-100

Industry News | 2016-03-07 14:06:37.0

Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.

AdoptSMT Europe GmbH

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb


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