Industry News: no flux proof (Page 1 of 2)

wave soldering has become the future direction of development

Industry News | 2018-10-18 09:33:23.0

wave soldering has become the future direction of development

Flason Electronic Co.,limited

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

KYZEN to Show New Fast-Acting IPA Alternative for Stencil Cleaning at NEPCON S China

Industry News | 2016-07-26 18:16:04.0

KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.

KYZEN Corporation

Research Reveals Higher Production Yields with One Minor Adjustment

Industry News | 2016-02-16 11:39:48.0

KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at the 2016 IPC APEX EXPO. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Booth #1869, March 15-17, 2016 at the Las Vegas Convention Center.

KYZEN Corporation

KYZEN to Debut Research Finding from Controlled Lab Tests at SMT Nuremberg 2018

Industry News | 2018-05-09 20:32:24.0

KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Hall 4A, Stand 536, June 5-7, 2018 at the Messe in Nuremberg, Germany. The introduction video can be viewed here: www.KYZEN-SneakPeek.com

KYZEN Corporation

SEHO PowerSelective with New Features

Industry News | 2009-06-09 04:57:14.0

Maximum Flexibility and Reproducibility in Selective Soldering

SEHO Systems GmbH

Kyzen Technology Experts to Present at SMTA Penang 2012

Industry News | 2012-11-08 12:01:36.0

Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.

KYZEN Corporation

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

Indium Engineers Gain SMTA Certification

Industry News | 2003-07-03 09:06:41.0

The Indium Corporation announced that three of its Technical Support Engineers have recently attained SMTA Certification for the SMT Process.

Indium Corporation

Kester Celebrates 110 Years in Business

Industry News | 2009-02-11 14:04:14.0

ITASCA, IL � February 2009 � Kester announces 110 years in business as a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets.

Kester

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