Industry News | 2014-06-24 20:50:40.0
Kyzen will showcase its new stencil cleaning line at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland.
Industry News | 2014-08-07 11:41:44.0
Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Industry News | 2014-08-19 09:34:26.0
Kyzen will showcase its new stencil cleaning products at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2015-01-19 21:20:27.0
Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.
Industry News | 2015-03-23 18:07:36.0
KYZEN will showcase its new stencil cleaning products with its distributor, Envoy, in Stand L501 at FIEE Brazil, scheduled to take place March 23-27, 2015 at Anhembi in São Paulo, Brazil. KYZEN’s stencil cleaning products have been designed from the ground up to meet the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the industry.
Industry News | 2016-04-18 11:31:46.0
Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.
Industry News | 2016-09-07 18:44:03.0
KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
Industry News | 2023-10-30 19:15:13.0
Indium Corporation has earned a Mexico Technology Award for its new low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented during an awards ceremony on October 25 at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico.
Industry News | 2012-08-15 10:34:48.0
Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that its CEO Michael Konrad will present “Electrical Leakage, Dendritic Growth, and White Residue – The Rush to Clean No-Clean” at the upcoming Cleaning and Reliability Workshop,