Industry News: no-clean (Page 10 of 62)

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Industry News | 2018-01-18 04:01:33.0

Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.

Balver Zinn

SHENMAO Introduces Cutting-Edge Low-Temperature Lead-Free Solder Wire PF735-LT201

Industry News | 2023-08-14 12:12:00.0

SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.

Shenmao Technology Inc.

SHENMAO Wins Mexico Technology Award for Innovative SMBF-08 Visible No-Clean BGA Flux

Industry News | 2023-10-31 18:58:18.0

SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.

Shenmao Technology Inc.

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Industry News | 2024-02-12 13:43:22.0

SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.

Shenmao Technology Inc.

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

Industry News | 2024-05-13 10:19:11.0

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.

Shenmao Technology Inc.

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at NEPCON Shenzhen

Industry News | 2010-08-04 21:14:00.0

Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium Corporation

Aqueous Technologies’ President Mike Konrad to Present at SMTA Carolinas Chapter Info Session

Industry News | 2012-03-12 19:39:06.0

Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that President Mike Konrad will present “Cleaning in a World of ‘No-Clean’” at 7 p.m. at the upcoming SMTA Carolinas Chapter meeting scheduled to take place on Thursday, March 15, 2012 at the Bose Corporation Headquarters in Blythewood, SC.

Aqueous Technologies Corporation

Kyzen to Exhibit Ultra Low VOC Stencil Cleaning Agent at SMTAI

Industry News | 2014-08-25 13:33:39.0

Kyzen will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

KYZEN Corporation

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Industry News | 2016-03-22 16:57:05.0

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation


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