Industry News: noclean flux concentration (Page 13 of 62)

Kester to Exhibit at SMT Hybrid Packaging 2017

Industry News | 2017-04-04 17:11:23.0

Kester will be exhibiting (booth # 4-533), at SMT Hybrid Packaging 2017, which will take place May 16-18 at the Exhibition Centre in Nuremberg, Germany.

Kester

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.

SHENMAO Technology will attend AutoTronics Taipei 2018

Industry News | 2018-04-05 17:27:40.0

SHENMAO America today announced plans to exhibit in Booth L1101 at AutoTronics Taipei 2018, scheduled to take place April 11-14 at the Nangang Exhibition Center. The company’s new PF610-P250 solder paste, PF606-F101 solder wire and SMCW-3 cleaner are designed for automotive applications.

Shenmao Technology Inc.

Kester to Exhibit at the 20th Annual Atlanta SMTA EXPO

Industry News | 2016-04-11 17:47:04.0

Kester will be exhibiting together with Gardner & Meredith at the 20th Annual Atlanta SMTA EXPO, which will take place on April 20 at the Infinite Energy Center (formerly Gwinnett Center) in Duluth, GA.

Kester

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Industry News | 2017-02-01 15:58:45.0

SHENMAO America supports the SMTA by sponsoring the Luau & Reception at the Pan Pacific Microelectronics Symposium event held at the Sheraton Poipu Kauai Resort in Kauai, Hawaii.

Shenmao Technology Inc.

SHENMAO Launches PF606-PW215 Water-Soluble Solder Paste

Industry News | 2018-07-19 20:30:51.0

SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.

Shenmao Technology Inc.

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Industry News | 2018-04-18 18:12:03.0

MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations

MicroCare Corporation

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Industry News | 2018-05-01 19:37:14.0

MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations

MicroCare Corporation

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Industry News | 2023-06-22 15:16:57.0

YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.

YINCAE Advanced Materials, LLC.

SHENMAO Introduces Low-Temperature Ball Attachment Process Solutions

Industry News | 2023-09-14 17:50:57.0

SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.

Shenmao Technology Inc.


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