Industry News | 2014-05-08 11:42:32.0
Kyzen announces plans to exhibit CYBERSOLV® C8882 at the SMTA Toronto Expo & Tech Forum, scheduled to take place Thursday May 15, 2014 at the Four Points By Sheraton Toronto Airport in Toronto, ON.
Industry News | 2014-09-22 17:51:09.0
he Balver Zinn Group introduces the new Bi Rework Solder Paste (de-soldering paste). The desoldering paste has been designed for desoldering Pb-free components and is ideal for LED removal.
Industry News | 2020-10-27 12:41:51.0
SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2018-07-02 21:37:24.0
SHENMAO America, Inc. is pleased to announce the appointment of Mr. Don Dennison of PIT Equipment Services to be their manufacturer’s rep covering Southeastern New York, New Jersey and Eastern Pennsylvania.
Industry News | 2019-05-13 17:42:18.0
SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
Industry News | 2016-10-14 16:20:50.0
Kester will be presenting at the IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware, which will take place October 25-27, 2016 at the Hyatt Rosemont, in Rosemont, IL.
Industry News | 2017-04-10 16:45:12.0
Kester will be exhibiting (booth #1H43) at SMTA China East/NEPCON, which will take place April 25-27 at the Shanghai World Expo Exhibition & Convention Center. Kester’s booth will offer attendees the opportunity to meet with the sales team and learn more about Kester’s new products.
Industry News | 2017-09-12 20:15:18.0
SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
Industry News | 2017-11-24 20:19:27.0
SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131
Industry News | 2017-11-28 09:32:15.0
SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
