Industry News | 2013-09-13 13:33:38.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2014-02-25 14:11:07.0
The Balver Zinn Group announces that Cobar Solder Products will exhibit at the SMTA Dallas and SMTA Houston Expos.
Industry News | 2001-12-12 07:21:44.0
AIM, Inc. and Nihon Almit Co., Ltd. today announced the signing of a worldwide license agreement for AIM's patented lead-free alloy, trade-named CASTIN®. The agreement enables Nihon Almit to manufacture and sell the alloy throughout the world.
Industry News | 2007-08-27 19:09:00.0
offered by Surface Mount Technology Association (SMTA)
Industry News | 2021-12-19 20:18:34.0
Encoder is a kind of electromechanical equipment, which can be used to measure the movement of machinery or the target position of machinery. Most encoders use optical sensors to provide electrical signals in the form of pulse sequences, which can be converted into motion, direction or position information in turn.
Industry News | 2014-04-16 13:17:25.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Industry News | 2021-07-13 16:24:19.0
New Vishay Intertechnology SMD HI-TMP Wet Tantalum Capacitors Save Board Space and Feature Operation to +200°C, Increased Thermal Shock Capabilities and Longer Life to 2,000 Hours
Industry News | 2020-12-22 12:29:59.0
New Yorker Electronics unveils new Exxelia High Temperature Film Capacitor Series Operating up to 200°C
Industry News | 2021-12-09 20:15:40.0
Pressure transmitter is composed of single chip microcomputer and micro displacement (differential) pressure sensitive element, which can complete multi-function detection and conversion from non electric quantity to electric quantity.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
