Industry News | 2011-05-16 15:56:59.0
JBC Tools announces that it will exhibit at the upcoming SMTA Oregon Symposium and Supplier Day, scheduled to take place Wednesday, May 18, 2011 at the Tektronix Building 38 Conference Center in Beaverton, OR.
Industry News | 2011-09-21 14:12:49.0
JBC Tools will exhibit in Booth #609 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2019-05-27 21:16:27.0
SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.
Industry News | 2021-06-30 04:24:18.0
Microtronic GmbH is pleased to introduce the new Automated & PC-Controlled D&L Automator for Dip and Look. Designed and manufactured in Germany, the new system meets IPC-J-STD-002 and 003 Standards.
Industry News | 2017-11-09 15:19:06.0
Ascentech, LLC will exhibit at and participate in the 2017 SMTA New England Expo and Technical Forum on Thursday, November 16, 2017 at the DCU Center, 50 Foster St., Worcester, Massachusetts. Ascentech will highlight the Inspectis C12 and the GEN3 Gensonic Ultrasonic stencil cleaner, and will discuss all of the products in the Ascentech product line in booth #0103.
Industry News | 2003-07-11 09:00:48.0
Alliance to accelerate the development of thermal solutions for large-scale electronic computer equipment, including Sanmina-SCI�s ECOBAY� line of enclosure products.
Industry News | 2015-09-14 18:22:50.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation will exhibit in Booth #606 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nordson’s team of Test and Inspection experts will demonstrate the XD7600NT Diamond FP X-ray inspection system from Nordson DAGE and FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system from Nordson YESTECH.
Industry News | 2015-11-01 17:36:12.0
Universal Instruments will demonstrate both its high-speed flexible Fuzion1-30™ and ultra-flexible Fuzion1-11™ platforms at Productronica 2015, held November 10–13 at the Munich Trade Fair Center, Germany. Complementing these solutions on the booth will be the Polaris Assembly Cell, offering cost-effective performance for extreme odd-form automation and light mechanical assembly applications. Universal will exhibit on Hall A2, Booth 459 in cooperation with channel partner, smartTec GmbH.
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2020-01-06 16:31:30.0
Viscom Inc. today announced that it will exhibit in Booth #3336 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Always at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra chrome and S3088 DT.
