Industry News: non-conductive paste (Page 1 of 1)

Advanced Precision Auger Pump – A Single Pump Solution

Industry News | 2016-02-27 22:11:00.0

GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.

GPD Global

Engineered Material Systems Introduces New Non-Conductive Paste

Industry News | 2014-01-29 14:32:03.0

Engineered Material Systems (EMS) debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.

Engineered Materials Systems, Inc.

Henkel’s Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology

Industry News | 2010-07-29 14:45:16.0

Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.

Henkel Electronic Materials

Henkel Launches Breakthrough Self-filleting Die Attach Technology

Industry News | 2008-12-06 02:17:55.0

Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik� brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.

Henkel Electronic Materials

Ventec Giga Solutions Appointed as Distributor for Sunus Printing Machines

Industry News | 2023-11-13 12:22:31.0

Ventec Giga Solutions, the equipment division of Ventec International Group announces its appointment by Sunus Precision Machinery as sales agent and distributor of Vacuum Filling Holes Solutions and Screen Printing Equipment. The agreement covers all regions globally outside of Asia.

Ventec International Group

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

MicroCare Introduces ‘Game-Changing’ Products at Productronica 2015

Industry News | 2015-12-13 18:44:00.0

The cleaning experts at MicroCare Europe enjoyed an unparalleled week of success at Productronica 2015. The MicroCare team was a clear stand-out at the show, with a strong message, new products and an impressive number of visitors coming to the stand. This level of commitment and innovation will help companies clean their PCBs faster, better and at lower cost while meeting ever-more stringent European and global regulations.

MicroCare Corporation

Six New Precision Cleaners Introduced by MicroCare at APEX 2016

Industry News | 2016-03-03 08:38:40.0

MicroCare Corp. will introduce six new products, including three new aerosol-packaged circuit cleaners, at the APEX Exposition in March 2016. These products use novel chemical formulations not previously on the market to help companies lower their PCB cleaning costs, improve product quality and meet ever-more stringent regulatory obligations.

MicroCare Corporation

Catching up with PNC

Industry News | 2015-11-16 10:47:48.0

Catching up with PNC with Dan Beaulieu, D.B. Management Group

PNC Inc.

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