Industry News: nordson board flipper (Page 16 of 32)

Nordson DAGE Awarded a EM Asia Innovation Award for Camera Assist Automatic Bondtesting on the 4000Plus

Industry News | 2015-04-22 14:52:28.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test Instruments for Camera Assist Automatic Bondtesting on the 4000Plus. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This is the fourth award for this application.

Nordson DAGE

Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools

Industry News | 2016-06-13 15:22:10.0

Nordson DAGE, a division of Nordson Corporation announces the opening of their Asian clean room demonstration facility. Located south of Seoul, Republic of Korea, close to Incheon International Airport and in the heart of South Korea’s technology base, this 102 m2 clean room and conferencing center provides all of their regional customers with access to Nordson DAGE’s award-winning 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.

Nordson DAGE

Nordson DAGE Receives the 2017 NPI Award for Test & Inspection – X-ray

Industry News | 2017-02-15 18:40:39.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), today announced that it has been awarded a 2017 NPI Award in the category of Test & Inspection – X-ray for its Quadra™ 7. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Nordson DAGE

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Industry News | 2017-10-12 15:21:08.0

Nordson DAGE announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.

Nordson DAGE

Nordson YESTECH Launch Advanced New FX-942 UV ACI In-Line Dual Sided Optical Inspection System at Productronica 2017

Industry News | 2017-11-28 19:38:13.0

Nordson YESTECH launched their latest innovation, the FX-942UV ACI In-Line Dual Sided Optical Inspection System for PCB conformal coating and parts, at the Productronica exhibition held in Munich, Germany from 14-17 November 2017.

Nordson YESTECH

Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Industry News | 2014-11-18 18:10:25.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.

Nordson DAGE

Computrol Installs Nordson DAGE’s Benchmark System for X-ray Inspection

Industry News | 2016-04-12 19:38:00.0

Computrol today announced that it has purchased a XD7600NT Ruby X-ray from Nordson DAGE. The system has been installed at Computrol’s Meridian, ID facility.

Computrol, Inc.

Joseph Stockunas, Nordson Corporation Corporate VP, Appointed to SEMI Foundation Board of Trustees

Industry News | 2018-02-21 20:10:41.0

Nordson Corporation announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

Nordson Corporation

Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego

Industry News | 2012-05-01 19:12:41.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference

Nordson DAGE

Dynalab Relies on Nordson YESTECH as Manufacturing Ramps up Following V.P. Mike Pence’s Recent Visit

Industry News | 2017-04-10 12:59:21.0

Nordson YESTECH, a subsidiary of Nordson Corporation is pleased to announce that Vice President Mike Pence was introduced to its YESTECH FX AOI system during his recent visit to Columbus, OH.

Nordson YESTECH


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