Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2011-04-20 21:26:17.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.
Industry News | 2018-02-25 08:08:37.0
ADLINK Technology is delivering ‘AI at the Edge’ solutions with NVIDIA technology. The combination of ADLINK embedded systems and connectivity solutions with NVIDIA’s AI and deep learning technologies is ideal for compute-intensive applications. This includes robotics, autonomous vehicles, healthcare and many other industries. This initiative is just one example of ADLINK’s ‘Leading EDGE COMPUTING’.
Industry News | 2018-09-22 20:56:48.0
At this years' GPU technology conference in Munich ADLINK Technology will also demonstrate the latest AI training platform ALPS-4800 plus their M200-JT2 Inference Platform and many more.
Industry News | 2014-05-26 06:06:08.0
MXM, VPX, XMC and Multi-Display Graphics Cards to Be Displayed
Industry News | 2017-01-20 20:03:05.0
ADLINK Technology introduces its VPX3010 Series rugged 3U VPX processor blade with 12-core Intel® Xeon® Processor D-1500 SoC for server-grade computing performance. A VPX3010 quick start kit and GPGPU companion products, such as an optional discreet VPX GPGPU blade or XMC module with the 384 CUDA core NVIDIA GeForce GT 745M GPU, help to reduce development risk and enhance the capabilities of the blade.
Industry News | 2018-09-04 05:34:10.0
The AMD Radeon™ Pro V340 graphics card is a dual-GPU solution based on the advanced AMD “Vega” architecture1, optimized to deliver extreme performance and high user density for virtualized environments. It is the first VDI hardware solution equipped with 32GB of ultra-fast, second-generation high-bandwidth memory, providing massive amounts of memory and bandwidth for today’s most complex design and media workloads.
Industry News | 2018-09-06 20:37:49.0
As a premier supplier to the telecom and network markets, ADLINK delivers advanced platforms with high performance, density and scalability, enabling customers to build solutions meeting the demands of next-generation, high-end application scenarios.
Industry News | 2007-11-08 21:29:06.0
Agilent Technologies Inc. (NYSE: A), the provider of the gold standard Protocol Test Card I (PTC I), today introduced the PTC II for PCI Express(r) (PCIe(tm)) 2.0. The Agilent PTC II will enable device compliance with the PCI-SIG(r) (PCI Special Interest Group) specifications and industry deployment of PCIe by providing all the mandatory test cases.
