Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2024-03-11 18:18:54.0
Booth 2538
Industry News | 2023-10-16 11:56:01.0
Booth A4.246/4
Industry News | 2010-04-12 15:30:49.0
IPC APEX Expo Conference and Exhibition, Las Vegas – Design engineers in the electronics industry who are seeking ways to improve power integrity and reduce electromagnetic interference (EMI) while meeting halogen-free requirements now have a new solution to meet their needs. The 3M Electronic Solutions Division now offers halogen-free* versions of its Embedded Capacitance Material (ECM).
Industry News | 2015-01-19 21:35:01.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal.
Industry News | 2022-01-03 07:22:33.0
Seika Machinery, Inc. is pleased to announce plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. Seika will highlight the following equipment in Booth #1914: McDry Storage Cabinets, Sawa Ecobrid Stencil Cleaner, Sayaka SAM-CT23S Table-Top PCB Router, Tsuchiyama n=1 Checker and MALCOM RCX Series Modular Reflow Oven Profiling System.
Industry News | 2016-02-20 20:36:54.0
Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
Industry News | 2018-09-18 20:14:13.0
Seika Machinery today announced plans to exhibit in Booth #307 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. Seika will showcase a complete line up of leading-edge equipment, including the latest models from McDry, Unitech, Sayaka and MALCOM.
Industry News | 2018-10-15 18:45:29.0
Seika Machinery today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018 at the Expo Guadalajara. Seika will discuss the latest equipment from McDry, Unitech, Sawa and MALCOM.
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
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