Industry News: off line (Page 20 of 60)

The new SIPLACE SX Road Show is traveling across Mexiko, Canada and the U.S.

Industry News | 2009-11-01 18:10:15.0

The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.

Siemens Process Industries and Drives

Data I/O’s FlashCORE III Recognized as a Benchmark for Excellence With a 2010 VISION Award

Industry News | 2010-04-11 01:11:51.0

REDMOND, Wash. - Data I/O Corporation (NASDAQ: DAIO) announces that it has been awarded a 2010 SMT VISION Award in the category of Device Programming for its FlashCORE III.

Data I/O Corporation

ORPRO Vision exhibits at SMT 2010

Industry News | 2010-04-29 08:28:45.0

ORPRO Vision is a global provider of Automated Optical Inspection solutions for the electronics assembly industry. We will showcase our complete range of AOI systems at SMT show booth 218, hall 6. SMT takes place June 8-10 at the Messezentrum Nuremberg. ORPRO Vision will demonstrate its complete range of paste and component inspection systems and the new table top prototype AOI system.

Orpro Vision GmbH

Mentor Graphics Announces OEM Worldwide’s Purchase and Implementation of Valor Software Solutions

Industry News | 2010-05-26 14:23:55.0

Wilsonville, OR - Mentor Graphics Corporation (NASDAQ: MENT) today announced that OEM Worldwide, an electronics contract manufacturer for medical, telecom and industrial markets, purchased its printed circuit board assembly software management solutions at the IPC/APEX Expo, held from April 6-8, 2010 in Las Vegas.

Mentor Graphics

NOTE UK leading the way in Package on Package through Siplace technology

Industry News | 2010-06-23 11:36:12.0

Siplace presented a solution to NOTE satisfying their wide ranging needs

Siemens Process Industries and Drives

Nordson YESTECH to Demonstrate Automated In-line PCB Inspection at Productronica

Industry News | 2013-10-25 17:55:58.0

Nordson YESTECH,a subsidiary of Nordson Corporation (Nasdaq: NDSN) will feature the FX SL AOI in Hall A2, Stand 438 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Nordson DAGE

Nordson DAGE and Nordson YESTECH to Display X-ray and AOI Systems at NEPCON China

Industry News | 2014-04-16 13:17:25.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.

Nordson DAGE

YESTECH's New Large Area LX-1000 Automated Optical Inspection System Enhances Inspection Capabilities

Industry News | 2020-03-14 10:19:41.0

YESTECH announced today the introduction of their all new LX-1000 large area Automated Optical Inspection system.

Nordson YESTECH

Nordson TEST & INSPECTION Will Exhibit with SMarTsol Technologies at SMTA Guadalajara

Industry News | 2022-08-26 09:23:24.0

Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The Assure™ Pro, Quadra 7, FX-940UV and FX-942 will be on display in the SMarTsol Technologies booth.

Nordson Corporation

TopLine Sponsors IMAPS Wire Bonding Conference

Industry News | 2018-03-13 18:47:01.0

TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

TopLine Dummy Components


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