Industry News: off pad reflow (Page 13 of 42)

BTU’s Fred Dimock will present at ACI Technologies’ Open House

Industry News | 2018-09-23 09:45:16.0

BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will present at ACI Technologies’ Open House. The event will take place on Tuesday, Sept. 25, 2018 on ACI’s manufacturing factory floor at its facility in Philadelphia, PA.

BTU International

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

Panelizing Small Sized PCBs

Industry News | 2018-10-18 10:48:32.0

Panelizing Small Sized PCBs

Flason Electronic Co.,limited

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Industry News | 2018-10-18 10:04:27.0

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Flason Electronic Co.,limited

Indium Corporation Features New Probe-Testable Solder Paste at APEX

Industry News | 2008-02-28 15:03:16.0

Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.

Indium Corporation

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

Visit Booth #1527 at the IPC APEX EXPO ― PARMI to Showcase HS-70 Solder Paste Inspection System

Industry News | 2013-01-17 16:15:15.0

PARMI will exhibit in booth #1527 at the IPC APEX EXPO.

PARMI

PARMI’s HS-70 Solder Paste Inspection System Receives Circuits Assembly’s Prestigious NPI Award

Industry News | 2013-02-25 16:05:16.0

PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.

PARMI


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