Industry News | 2006-09-29 17:32:14.0
Indium Corporation was recognized with the Global Technology Award for its Indium5.1AT Pb-Free Solder Paste
Industry News | 2009-03-10 14:58:48.0
FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2013-10-31 12:21:25.0
The MPM Momentum family of printers by Speedline, including the Momentum series and new platform Momentum Compact, offer enhanced wet print accuracy for high precision and superior performance in meeting today's emerging electronics assembly challenges.
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Industry News | 2012-09-12 17:00:31.0
Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Industry News | 2008-09-16 12:35:27.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER� CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in Schaumburg, IL.
Industry News | 2009-01-30 16:42:42.0
San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature KIC's new RPI, Reflow Process Inspection. KIC also will be showing the KIC Explorer Dual model that may be used as a datalogger or as a real-time profiler using radio frequency technology. KIC will be in representative Mectronics Marketing Services' booth, located in Hall #18 in booth #406, at the Componex/Nepcon India 2009, scheduled to take place February 24-26, 2009 in New Delhi.
Industry News | 2009-03-27 10:06:36.0
San Diego � March 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature KIC's new RPI, Reflow Process Inspection.
