Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2009-10-09 23:09:30.0
San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, its Americas Sales Manager, will present “Understanding the Thermal Reflow Process” at 3:30 p.m. at the upcoming SMTA Long Island Chapter Tabletop Show, scheduled to take place Thursday, October 15 at the Hyatt Regency Wind Watch in Hauppauge, NY.
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Industry News | 2012-09-12 17:00:31.0
Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Industry News | 2008-03-20 15:46:19.0
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2012-04-26 14:23:29.0
OK International today announced that it has been awarded a 2012 EM Asia Innovation Award in the category of Repair/Rework Equipment for its Scorpion Rework System
Industry News | 2013-01-10 17:41:47.0
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 413 at the upcoming Medical Design & Manufacturing (MD&M)/Electronics West Exposition
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
Industry News | 2013-03-18 13:30:19.0
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 9-517 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
