Industry News: offset and print (Page 6 of 130)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Resources and Solutions to Address Challenges in Printed Boards and Electronics Manufacturing Focus of IPC Midwest

Industry News | 2011-06-20 19:55:16.0

IPC Midwest Conference & Exhibition will be held September 21–22, 2011, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill. After being a co-located event in Rosemont in 2010, IPC Midwest will be produced solely by IPC in 2011 and will bring focused, targeted and relevant information for the electronics manufacturing and printed boards industries.

Association Connecting Electronics Industries (IPC)

IPC and DPC Collaborate on Web Seminar

Industry News | 2003-04-29 07:30:06.0

Announce their plans to co-sponsor a free online conference on the current state of bare die packaging

Association Connecting Electronics Industries (IPC)

IPC and Northrop Grumman Sponsor HDI Conference

Industry News | 2011-01-20 13:54:40.0

IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.

Association Connecting Electronics Industries (IPC)

Understanding Environmental and Conflict Minerals Regulations

Industry News | 2013-04-16 15:45:33.0

Get information on developing industry practices at IPC Conflict Minerals Update and It’s Not Easy Being Green conferences

Association Connecting Electronics Industries (IPC)

Joint IPC and UBM Canon Event Generates Sales and Solid Leads for Exhibitors and Valuable Technical Content and Contacts for Attendees

Industry News | 2010-10-30 02:09:14.0

The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.

Association Connecting Electronics Industries (IPC)

IPC Seeks Papers, Course Proposals and Exhibitors for Inaugural Electronic System Technologies Conference and Exhibition

Industry News | 2012-09-26 15:57:01.0

l IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC and SMTA Announce the Agenda for Session 6 of the High-Reliability Cleaning and Coating Conference

Industry News | 2012-10-29 09:36:36.0

IPC and SMTA jointly announce the keynote speaker and the topics you need to hear during session 6 of the IPC/SMTA High Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

IPC and SMTA to Host High-Reliability Cleaning and Conformal Coating Conference

Industry News | 2012-10-17 18:52:21.0

IPC — Association Connecting Electronics Industries® in partnership with Surface Mount Technology Association (SMTA) will host a High-Reliability Cleaning and Conformal Coating Conference, November 13–15, 2012, at the Crowne Plaza Hotel-O’Hare in Chicago.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)


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