Industry News: operational process validation methods (Page 16 of 76)

STI Electronics Selected for a Best Paper Award for BTC/QFN Test Board Design Research

Industry News | 2017-01-17 15:39:40.0

STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.

STI Electronics

Dr. Mike Bixenman Co-Authors Three Papers to be Presented During SMTAi

Industry News | 2017-08-29 15:45:56.0

KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.

KYZEN Corporation

The New Metcal Connection Validation™ Receives a 2017 NPI Award

Industry News | 2017-02-15 18:47:46.0

Metcal announces that it has been awarded a 2017 NPI Award in the category of Soldering – Hand Tools for its CV-5200 Connection Validation™ Soldering Station, as selected by an independent panel of practicing industry engineers. Evaluation of the award entries is based on several criteria, including innovation; compatibility with existing technology; cost-effectiveness; design, and more. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Metcal

Package Converters Enable Testing Generation I product on Generation II System

Industry News | 2010-11-30 13:30:04.0

Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.

Ironwood Electronics

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

Metcal to Launch Connection Validation – the Latest Innovation in Hand Soldering – at APEX

Industry News | 2017-01-11 18:13:13.0

Metcal today announced plans to exhibit at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will showcase its hand soldering systems and tools, the Scarab Site Cleaning System, Scorpion Rework System, and fume extraction systems in Booth #3035.

Metcal

Metcal Brings the Latest Innovation in Hand Soldering to NEPCON China

Industry News | 2017-03-23 13:05:52.0

Metcal today announced plans to exhibit at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase its convection rework and hand soldering systems and tools, including the new CV-5200 Connection Validation™ Soldering Station and High Thermal Demand upgrade kit in Stand 1H39.

Metcal

Innovative Bench-top Soldering Equipment from Metcal at SMTAI

Industry News | 2017-08-16 17:21:47.0

Metcal today announced plans to exhibit in Booth #208 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase innovative new products including its Connection Validation Hand Soldering System with monitoring software (CV-5210), High Thermal Demand (HTD) handpiece, and introduce the new AC-STC Solder Tip Cleaner.

Metcal

Dr. Mike Bixenman to Present at the SMTA Medical Electronics Symposium

Industry News | 2018-04-25 20:16:44.0

KYZEN today announced that Mike Bixenman, DBA, will present at the SMTA Medical Electronics Symposium, scheduled to take place May 16-17, 2018 at the University of Texas at Dallas. In addition to the presentation, Jack Reinke, KYZEN cleaning expert, will be at table #8 during the Expo. Reinke will be available to meet with attendees to answer cleaning process questions.

KYZEN Corporation


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